Military Embedded Systems E-letter - May 2013
 
 
E-letter May 2013
GPUDirect RDMA
By GE Intelligent Platforms, Inc.
GPUDirect RDMA greatly decreases the latency of streaming data into the GPU from external PCIe endpoints and increases bandwidth through more efficient PCIe intercommunication.
SECTION: Defense Tech Wire
Remembering a friend and mentor
By John McHale, Editorial Director
Ron Mastro thrived in the military electronics market and took great pride that his little publishing niche covered an institution – the U.S. military – that he loved and respected.
SECTION: Defense Tech Wire
Defense Tech Wire: Boeing/U.S. Army contract hat trick, Raytheon to extend Standard Missile-3 support, scientists search for silicon alternative
By Sharon Hess, Managing Editor
Could silicon become a thing of the past?; Boeing and U.S. Army sign trio of contracts; USAF, Italy, Australia benefit from Lockheed mod; Standard Missile-3 gets more support. (U.S. Army photo by Tech. Benjamin Faske)
SECTION: Mil Tech Trends
Small form factor designs balance performance, power
By Brandon Lewis, Associate Editor, and Monique DeVoe, Assistant Managing Editor
The embedded COTS community is offering various Small Form Factor (SFF) flavors - off-the-shelf or customized - while industry groups such as VITA are developing standards to provide some order to the growing SFF demand. (Photo courtesy of Parvus Corporation)
SECTION: Industry Spotlight
Cache partitioning increases CPU utilization for safety-critical multicore applications
By Tim King, DDC-I
Cache partitioning reduces worst-case execution time for critical tasks, thereby enhancing CPU utilization, especially for multicore applications. (U.S. Air Force photo by Tech. Sgt. Dana Rosso)
FACE, ARINC, DO-178C avionics standards help U.S. DoD's vision of reusable technology to take off
By Bernard Dion, Esterel Technologies, a subsidiary of ANSYS, Inc.
While historically single-vendor procured, today's airborne systems utilized by the U.S. DoD need to instead comply with the DoD's vision of more cost-efficient, reusable, modular, standards-based applications ready for flight in both manned and unmanned airspace. Standards such as the Future Airborne Capability Environment (FACE), ARINC 653 and 661, and DO-178C are helping the military avionics industry achieve this paradigm.
SECTION: White Papers
Characterisation of boundary conditions for an aircraft engine electronic control unit
By Mentor Graphics Corporation
Thermal analysis is performed on an aircraft engine ECU.
SECTION: Sister Publication Article
VITA Technologies magazine
Stacked up: Standardizing mezzanine modules
By Jerry Gipper, VITA Technologies magazine Editorial Director
Mezzanine modules are an important design element to many board form factors. They grew out of a necessity to gain more board real estate or to incorporate modular flexibility to the original form factor. In the early days, few, if any, standards for mezzanines existed. However, over time, standards emerged to make it easier to incorporate mezzanines into designs.
Proto Labs
Parts in 1 day; new design tips volume
WinSystems
Fanless -40° to +85°C 1.66GHz Atom™ PC/104-Plus SBC
Esterel Technologies
Production-Proven Critical Systems and Software Development Solutions
Diamond Systems
Athena III PC/104 SBC based on Intel E-Series CPUs
Integre Technologies
Open up your FPGA Design to the power of the Texas Instruments DSP with the Integretek HyperLink High Speed DSP Interface Core
TEWS Technologies
32 Channel M-LVDS FMC Mezzanine Module
Innovative Integration
New SBC-K7 Embedded PC with Kintex-7 FPGA & Dual FMCs
Pico Electronics
Size Does Matter! Miniature Transformers and Inductors for Mission Critical Applications
North Atlantic Industries
Nano Interface Unit (NIU1) ... Connect with Us
Annapolis Micro Systems
Dual Twelve Bit 2.3 or 1.5 GSps DAC I/O Card
Ballard Technology
Compact Computer/
Interface Device for Demanding Aerospace and Ground Mobile Environments
Schroff
Schroff® Retainers and Conduction Cooled Assemblies Provide Secure, Reliable PCB Protection
Extreme Engineering Solutions (X-ES)
Rugged Intel® Core™ i7 COM Express Module
Intel Embedded Innovator
A Framework for the Internet of Things in the 7th Edition of "Embedded Innovator" Magazine
Wind River
E-Book – Intelligent Systems Journal: Designing For Next Generation Smart Connected Device
SECTION: Upcoming E-Casts.  An E-cast is a live webcast that may have a single or multiple vendors. E-cast events are used to educate audiences about a problem/solution, from the vendor's perspective. The presentation is typically 45 minutes in duration with a 15-minute moderated Q&A session.
SYNOPSIS: A one-hour, live, moderated problem/solution technical webcast.

E-cast Schedule:

Learn How to Develop a Distributed Game of Life with DDS

May 15th   11   am  EDT
Presented by: RTI
Speakers: Reinier Torenbeek (Systems Architect, RTI)
Moderated by: John Mchale, Editorial Director, OpenSystems Media

Architecture, Agility, and Measurement--understanding and addressing risk in A and D programs

May 16th   11   am  EDT
Presented by: IBM
Speakers: Brian T. Nolan Ph.D. (Go to Market Manager, Aerospace & Defense, IBM Software, Rational); Jim Densmore (Sr. Certified Solution Architect, IBM Rational Solution Delivery, IBM Software, Rational)
Moderated by: John Mchale, Editorial Director, OpenSystems Media

Accelerate your mobile apps for Android on ARM

May 30th   11   am  EDT
Presented by:
Speakers: Matthew Du Puy (Software Engineer, ARM)
Moderated by: Curt Schwaderer, Technology Editor, OpenSystems Media
For additional E-casts, check out the Broadcast Archive.

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